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Via is used for connecting successive metal layers like metal 1 to metal 3 etc, whereas contact is used to connect the poly-silicon to the metal 1 for external pin connections

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βˆ™ 12y ago
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βˆ™ 7mo ago

"Via" refers to a hole that is drilled through a layer of material to connect different layers in a semiconductor device. "Contact" refers to the metal or conductive material that is deposited inside the via to make an electrical connection between the layers. In other words, via is the physical hole and contact is the material that fills the hole to make the connection.

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Q: What is the difference between via and contact in silicon?
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