Via is used for connecting successive metal layers like metal 1 to metal 3 etc, whereas contact is used to connect the poly-silicon to the metal 1 for external pin connections
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"Via" refers to a hole that is drilled through a layer of material to connect different layers in a semiconductor device. "Contact" refers to the metal or conductive material that is deposited inside the via to make an electrical connection between the layers. In other words, via is the physical hole and contact is the material that fills the hole to make the connection.
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Heat moves in predictable ways through three main mechanisms: conduction, convection, and radiation. Conduction occurs when heat is transferred through direct contact between materials. Convection involves the movement of heat through a fluid (liquid or gas) via circulation. Radiation is the transfer of heat through electromagnetic waves. These mechanisms follow predictable patterns based on the materials involved and the temperature difference between them.
Thermal energy transfer refers to the process by which heat is exchanged between objects or systems due to a temperature difference. This transfer can occur through conduction (direct contact), convection (through fluids like air or water), or radiation (via electromagnetic waves). Thermal energy transfer plays a crucial role in regulating temperatures in the environment and determining the thermal equilibrium between objects.
Conduction generally works best in solids due to the close proximity of particles. In gases, conduction is not as effective because the particles are further apart and have lower contact with each other.